The Department of Electronics and Communication Engineering have signed an MoU with Tessolve Semiconductors on 20.11.17. The purpose of this MoU is to have mutual intentions to jointly work on projects required for industries and research needs, with learned faculty of good industrial experience and promising students, jointly agree to exchange their expertise for mutual benefit and growth. Tessolve Semiconductors is a multinational semiconductor engineering solution provider. Tessolve offers engineering expertise in the areas of Semiconductor Design, Test/Product Engineering, PCB Design, Failure Analysis and Systems design. Tessolve’s goal is to be an extended arm of Semiconductor product companies and enable them to ensure good quality productization of their chips in a cost effective manner. Since its inception in 2004, Tessolve has grown from strength to strength. It currently has over 750 employees with offices in Bangalore, Coimbatore, Singapore, Santa Clara and Dallas. Tessolve engineers have executed complex projects for several leading semiconductor companies.
It provides a good chance to the students of Electronics and Communication Engineering to take up a course in Semiconductor Chip Testing. The key objective of the MoU is to bridge the gap between theory and practice and make education a more meaningful tool to meet the challenges in the competitive world. Through this robust practical training approach, the MoU would focus on making way for a solid practical training on-ground in addition to the theoretical learning on campus. Under the aegis of the MoU, specialized courses would be taught by experts from Industries and Institutions.